CFD modelling of friction stir welding of thick plate 7449 aluminium alloy

By Colegrove P. A.   Shercliff H. R.  

Science and Technology of Welding & Joining, Vol. 11, Iss. 4, 2006-07 ,pp. : 429-441

Maney Publishing

Access to resources Recommend Favorite

Investigation of oxygen followed by argon plasma treatment on LED chip bond pad for wire bond application

By PengHui YuenSchool of Physics   Universiti Sains Malaysia   Penang   Malaysia   DevarajanMutharasuSchool of Physics   Universiti Sains Malaysia   Penang   Malaysia   LeeTeik ToonSolid State Lighting Department   OSRAM Opto Semiconductor Sdn. Bhd.   Penang   Malaysia   LaceyDavidResearch and Innovation Department   OSRAM Opto Semiconductor Sdn. Bhd.   Penang   Malaysia  

Soldering & Surface Mount Technology, Vol. 27, Iss. 4, 2015-09 ,pp. : 129-136

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

Interfacial microstructure between thick aluminium wires and aluminium alloy pads formed by ultrasonic bonding

By Maeda M   Kitamori S   Takahashi Y  

Science and Technology of Welding & Joining, Vol. 18, Iss. 2, 2013-02 ,pp. : 103-107

Maney Publishing

Access to resources Recommend Favorite

Temperature-dependent variability in lifetime prediction of thermally activated systems

By Raj R.   Raj I.   Frangopol D.   Kong J.  

Metallurgical and Materials Transactions A, Vol. 35, Iss. 5, 2004-05 ,pp. : 1471-1476

Springer Publishing Company

Access to resources Recommend Favorite

Prediction of bending limits in friction-stir-processed thick plate aluminum

By Miles M.   Mahoney M.   Fuller C.  

Metallurgical and Materials Transactions A, Vol. 37, Iss. 2, 2006-02 ,pp. : 399-404

Springer Publishing Company

Access to resources Recommend Favorite