Pulsed Current Electrodeposition of Mn-Cu Alloys on SUS 430 Substrate as Coating Material for SOFC Interconnect Application

Publisher: Trans Tech Publications

E-ISSN: 1662-8985|2015|1125|131-135

ISSN: 1022-6680

Source: Advanced Materials Research, Vol.2015, Iss.1125, 2015-11, pp. : 131-135

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