Liquid phase sintered Cu–In composite solders for thermal interface material and interconnect applications

Author： Liu J.   Kumar P.   Dutta I.   Raj R.   Sidhu R.   Renavikar M.   Mahajan R.  

Publisher： Springer Publishing Company

ISSN： 0022-2461

Source： Journal of Materials Science, Vol.46, Iss.21, 2011-11, pp. : 7012-7025

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