Effect of Cu on the Electrochemical Corrosion Behavior of Sn-8Zn-3Bi Lead-Free Solder Alloy

Publisher： Trans Tech Publications

E-ISSN： 1662-8985|2015|1095|95-98

ISSN： 1022-6680

Source： Advanced Materials Research, Vol.2015, Iss.1095, 2015-04, pp. : 95-98

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Effects of microstructure and temperature on corrosion behavior of Sn-3.0Ag-0.5Cu lead-free solder

By Wang Mingna  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 148-155

Springer Publishing Company

Access to resources Recommend Favorite

Investigation of microstructures and tensile properties of a Sn-Cu lead-free solder alloy

By Zhu Fulong   Zhang Honghai   Guan Rongfeng   Liu Sheng  

Journal of Materials Science: Materials in Electronics, Vol. 17, Iss. 5, 2006-05 ,pp. : 379-384

Springer Publishing Company

Access to resources Recommend Favorite

Properties and microstructure of Sn-9Zn lead-free solder alloy bearing Pr

By Xiao Zhengxiang   Xue Songbai   Hu Yuhua   Ye Huan   Gao Lili   Wang Hui  

Journal of Materials Science: Materials in Electronics, Vol. 22, Iss. 6, 2011-06 ,pp. : 659-665

Springer Publishing Company

Access to resources Recommend Favorite

Room-temperature indentation creep of lead-free Sn–Bi solder alloys

By Mahmudi R.   Geranmayeh A.   Mahmoodi S.   Khalatbari A.  

Journal of Materials Science: Materials in Electronics, Vol. 18, Iss. 10, 2007-10 ,pp. : 1071-1078

Springer Publishing Company

Access to resources Recommend Favorite

Interfacial microstructure and mechanical properties of In-Bi-Sn lead-free solder

By Huang M.  

Journal of Materials Science: Materials in Electronics, Vol. 24, Iss. 7, 2013-07 ,pp. : 2624-2629

Springer Publishing Company

Access to resources Recommend Favorite