Properties and microstructure of Sn-9Zn lead-free solder alloy bearing Pr

Author: Xiao Zhengxiang   Xue Songbai   Hu Yuhua   Ye Huan   Gao Lili   Wang Hui  

Publisher: Springer Publishing Company

ISSN: 0957-4522

Source: Journal of Materials Science: Materials in Electronics, Vol.22, Iss.6, 2011-06, pp. : 659-665

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

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Abstract

In the present work, effects of trace amount of Pr on the microstructure, wettability and mechanical properties of Sn-9Zn solder were studied. The range of Pr content in Sn-9Zn solder alloys varied from 0.01 to 0.25 wt%. Test results indicate that adding appropriate amount of Pr can evidently improve the wettability and mechanical properties of the Sn-9Zn solder alloy. The Sn-9Zn-0.08Pr solder shows the best comprehensive properties compared to other solders with different Pr content. At the same time, notable changes in microstructure were found compared with the Pr-free alloy. The needle-like Zn-rich phase in the Sn-9Zn solder was refined and became more uniform. Moreover, the thickness of the IMC layer at Sn-9Zn/Cu substrate was remarkably depressed with Pr addition.