Publisher: Trans Tech Publications
E-ISSN: 1662-9795|2015|660|93-96
ISSN: 1013-9826
Source: Key Engineering Materials, Vol.2015, Iss.660, 2015-09, pp. : 93-96
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Soldering & Surface Mount Technology, Vol. 27, Iss. 2, 2015-04 ,pp. :
Dissolution kinetics of copper in lead-free liquid solders
Soldering & Surface Mount Technology, Vol. 27, Iss. 2, 2015-04 ,pp. :