Wettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate

Publisher： Trans Tech Publications

E-ISSN： 1662-9752|2015|830|215-218

ISSN： 0255-5476

Source： Materials Science Forum, Vol.2015, Iss.830, 2015-10, pp. : 215-218

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Abstract

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