Wetting Kinetics and Joint Strength of Sn-0.3Ag-0.7Cu Lead-Free Solder Alloy on Copper Substrate as a Function of Reflow Time

Publisher： Trans Tech Publications

E-ISSN： 1662-9752|2015|830|286-289

ISSN： 0255-5476

Source： Materials Science Forum, Vol.2015, Iss.830, 2015-10, pp. : 286-289

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