Design of Experiment (DOE) of Powder Metallurgy Technique in Fabricating SnCu/Carbon Lead-Free Composite Solder with Different Mixing Parameters

Publisher： Trans Tech Publications

E-ISSN： 1662-9752|2014|803|269-272

ISSN： 0255-5476

Source： Materials Science Forum, Vol.2014, Iss.803, 2015-01, pp. : 269-272

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

The Effects of Zinc Addition on the Microstructure, Melting Point and Microhardness of Sn-0.7Cu Lead-Free Solder Fabricated via Powder Metallurgy Method

By  

Materials Science Forum, Vol. 2016, Iss. 857, 2016-06 ,pp. : 13-17

Trans Tech Publications

Access to resources Recommend Favorite

Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses

By  

Materials Science Forum, Vol. 2015, Iss. 830, 2015-10 ,pp. : 265-269

Trans Tech Publications

Access to resources Recommend Favorite

Effect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder

By  

Materials Science Forum, Vol. 2015, Iss. 815, 2015-05 ,pp. : 109-114

Trans Tech Publications

Access to resources Recommend Favorite

Effect of Boron on Microstructure and Properties of Sn-1.0Ag-0.5Cu Low-Silver Lead-Free Solder

By  

Materials Science Forum, Vol. 2017, Iss. 898, 2017-07 ,pp. : 908-916

Trans Tech Publications

Access to resources Recommend Favorite

Study of structural changes and properties for Sn–Zn 9 lead-free solder alloy with addition of different alloying elements

By Kamal Mustafa   Meikhail M.   El-bediwi Abu   Gouda El-said  

Radiation Effects and Defects in Solids, Vol. 160, Iss. 1-2, 2005-01 ,pp. : 45-52

Taylor & Francis Ltd

Access to resources Recommend Favorite