Effect of Boron on Microstructure and Properties of Sn-1.0Ag-0.5Cu Low-Silver Lead-Free Solder

E-ISSN： 1662-9752|2017|898|908-916

ISSN： 0255-5476

Source： Materials Science Forum, Vol.2017, Iss.898, 2017-07, pp. : 908-916

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Effect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder

Materials Science Forum, Vol. 2015, Iss. 815, 2015-05 ,pp. : 109-114

Trans Tech Publications

Access to resources Recommend Favorite

Effect of TiO

Materials Science Forum, Vol. 2014, Iss. 803, 2015-01 ,pp. : 273-277

Trans Tech Publications

Access to resources Recommend Favorite

Intermetallic Study on the Modified Sn-3.5Ag-1.0Cu-1.0Zn Lead Free Solder

Materials Science Forum, Vol. 2016, Iss. 857, 2016-06 ,pp. : 3-7

Trans Tech Publications

Access to resources Recommend Favorite

Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses

Materials Science Forum, Vol. 2015, Iss. 830, 2015-10 ,pp. : 265-269

Trans Tech Publications

Access to resources Recommend Favorite

Wetting Kinetics and Joint Strength of Sn-0.3Ag-0.7Cu Lead-Free Solder Alloy on Copper Substrate as a Function of Reflow Time

Materials Science Forum, Vol. 2015, Iss. 830, 2015-10 ,pp. : 286-289

Trans Tech Publications

Access to resources Recommend Favorite