Development of Low Cost Sn-0.7Cu Base Composite Solder for High Temperature Application

E-ISSN： 1662-9752|2014|803|239-242

ISSN： 0255-5476

Source： Materials Science Forum, Vol.2014, Iss.803, 2015-01, pp. : 239-242

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Nanoindentation of Sn3.0Ag0.5Cu/ENIG Solder Joint after High Temperature Storage

Materials Science Forum, Vol. 2016, Iss. 857, 2016-06 ,pp. : 40-43

Trans Tech Publications

Access to resources Recommend Favorite

Hybrid Microwave-Assisted Rapid Sintering Process for Fabrication of Sn-0.7Cu+1.0wt.%Si

Materials Science Forum, Vol. 2014, Iss. 803, 2015-01 ,pp. : 305-309

Trans Tech Publications

Access to resources Recommend Favorite

Effect of Ag Addition on Growth of the Interfacial Intermetallic Compounds between Sn-0.7Cu Solder and Cu Substrate

Materials Science Forum, Vol. 2015, Iss. 815, 2015-05 ,pp. : 129-134

Trans Tech Publications

Access to resources Recommend Favorite

Suppression of Cu₃Sn with Ni in High Cu Containing Sn-Cu Solder Alloys

Materials Science Forum, Vol. 2016, Iss. 857, 2016-06 ,pp. : 53-57

Trans Tech Publications

Access to resources Recommend Favorite

Polarization Study of Sn-0.7Cu Solder Alloy in 1M Hydrochloric Solution

Materials Science Forum, Vol. 2017, Iss. 888, 2017-04 ,pp. : 394-399

Trans Tech Publications

Access to resources Recommend Favorite