Effect of Si3N4 Addition on the Properties of Sn-1.0Ag-0.7Cu Solder Alloy

Publisher: Trans Tech Publications

E-ISSN: 1662-9752|2015|819|167-172

ISSN: 0255-5476

Source: Materials Science Forum, Vol.2015, Iss.819, 2015-07, pp. : 167-172

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract