A quantitative investigation of the influence with the components of the CMP alkali slurry on the polishing rate

Author： Shiyan Fan   Enhai Liu   Jun Zhang   Yuling Liu   Lei Wang   Kai Lin   Ming Sun   Lukui Shi  

Publisher： IOP Publishing

ISSN： 1674-4926

Source： Journal of Semiconductors, Vol.36, Iss.9, 2015-09, pp. : 96001-96006

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