Efficient Photoresist Residue Removal with 172nm Excimer Radiation

E-ISSN： 1662-9779|2016|255|122-125

ISSN： 1012-0394

Source： Solid State Phenomena, Vol.2016, Iss.255, 2016-10, pp. : 122-125

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

172 nm Excimer Radiation as a Technology Accelerator for Bio-Electronic Applications

Solid State Phenomena, Vol. 2016, Iss. 255, 2016-10 ,pp. : 366-372

Trans Tech Publications

Access to resources Recommend Favorite

Removal of Carbon Contamination on Si Wafers with an Excimer Lamp

By TODE MAYUMI TAKIGAWA YASUO IGUCHI TAIZO MATSUURA HIDEHARU OHMUKAI MASATO SASAKI WATARU

Metallurgical and Materials Transactions A, Vol. 38, Iss. 3, 2007-03 ,pp. : 596-598

Springer Publishing Company

Access to resources Recommend Favorite

Evaluation of Post Etch Residue Cleaning Solutions for the Removal of TiN Hardmask after Dry Etch of Low-k Dielectric Materials on 45 nm Pitch Interconnects

Solid State Phenomena, Vol. 2016, Iss. 255, 2016-10 ,pp. : 232-236

Trans Tech Publications

Access to resources Recommend Favorite

Study of Etchants’ Diffusion into a 248 nm Deep UV Photoresist during a Wet Etch

Solid State Phenomena, Vol. 2014, Iss. 219, 2014-01 ,pp. : 183-186

Trans Tech Publications

Access to resources Recommend Favorite

Electrolyzed Water for Efficient Metal Removal

Solid State Phenomena, Vol. 2016, Iss. 255, 2016-10 ,pp. : 375-380

Trans Tech Publications

Access to resources Recommend Favorite