Thin Layer Etching of Silicon Nitride: Comparison of Downstream Plasma, Liquid HF and Gaseous HF Processes for Selective Removal after Light Ion Implantation

Publisher： Trans Tech Publications

E-ISSN： 1662-9779|2016|255|69-74

ISSN： 1012-0394

Source： Solid State Phenomena, Vol.2016, Iss.255, 2016-10, pp. : 69-74

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