The Endochronic Viscoplasticity for Sn/3.9Ag/0.6Cu Solder Under Low Strain Rate Fatigue Loading Coupled with Thermal Cycling

Publisher： Cambridge University Press

E-ISSN： 1811-8216|25|3|261-270

ISSN： 1727-7191

Source： Journal of Mechanics, Vol.25, Iss.3, 2009-09, pp. : 261-270

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Abstract

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