Cyclic Stress-Strain Behavior of BGA (Sn/3.5Ag/0.75Cu) Solder Joint under Cyclically Oblique Displacement Tests and Endochronic Viscoplastic Predictions

Publisher： Cambridge University Press

E-ISSN： 1811-8216|26|4|453-463

ISSN： 1727-7191

Source： Journal of Mechanics, Vol.26, Iss.4, 2010-12, pp. : 453-463

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Abstract

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