Microstructure Evolution in the Mushy Zone of a β‐Solidifying TiAl Alloy under Different Cooling Processes 

Publisher： John Wiley & Sons Inc

E-ISSN： 1527-2648|18|9|1667-1673

ISSN： 1438-1656

Source： ADVANCED ENGINEERING MATERIALS (ELECTRONIC), Vol.18, Iss.9, 2016-09, pp. : 1667-1673

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