Effects of Hybrid Structures on the Stress Reduction and Thermal Properties of Joints in Electronics Devices

Publisher: Trans Tech Publications

E-ISSN: 1662-9752|2016|879|1258-1264

ISSN: 0255-5476

Source: Materials Science Forum, Vol.2016, Iss.879, 2017-02, pp. : 1258-1264

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Abstract