MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronics

Author： Amon C.H.   Murthy J.   Yao S.C.   Narumanchi S.   Wu C.-F.   Hsieh C.-C.  

Publisher： Elsevier

ISSN： 0894-1777

Source： Experimental Thermal and Fluid Science, Vol.25, Iss.5, 2001-11, pp. : 231-242

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