Oxide-Oxide Thermocompression Direct Bonding Technologies with Capillary Self-Assembly for Multichip-to-Wafer Heterogeneous 3D System Integration

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Micromachines, Vol. 7, Iss. 10, 2016-10 ,pp. : 184-184

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Modeling Self-Assembly Across Scales: The Unifying Perspective of Smart Minimal Particles

By Mastrangeli Massimo   Mermoud Grégory   Martinoli Alcherio  

Micromachines, Vol. 2, Iss. 2, 2011-03 ,pp. : 82-115

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Self-Assembly in Micro- and Nanofluidic Devices: A Review of Recent Efforts

By Khoo Hwa Seng   Lin Cheng   Huang Shih-Hao   Tseng Fan-Gang  

Micromachines, Vol. 2, Iss. 1, 2011-02 ,pp. : 17-48

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Surface Tension Directed Fluidic Self-Assembly of Semiconductor Chips across Length Scales and Material Boundaries

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Micromachines, Vol. 7, Iss. 4, 2016-03 ,pp. : 54-54

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Fluid-Mediated Stochastic Self-Assembly at Centimetric and Sub-Millimetric Scales: Design, Modeling, and Control

By Haghighat Bahar   Mastrangeli Massimo   Mermoud Grégory   Schill Felix   Martinoli Alcherio  

Micromachines, Vol. 7, Iss. 8, 2016-08 ,pp. : 138-138

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