Self-Assembly of Chip-Size Components with Cavity Structures: High-Precision Alignment and Direct Bonding without Thermal Compression for Hetero Integration

By Fukushima Takafumi   Konno Takayuki   Iwata Eiji   Kobayashi Risato   Kojima Toshiya   Murugesan Mariappan   Bea Ji-Chel   Lee Kang-Wook   Tanaka Tetsu   Koyanagi Mitsumasa  

Micromachines, Vol. 2, Iss. 1, 2011-02 ,pp. : 49-68

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Investigation of Surface Pre-Treatment Methods for Wafer-Level Cu-Cu Thermo-Compression Bonding

By Tanaka Koki   Wang Wei-Shan   Baum Mario   Froemel Joerg   Hirano Hideki   Tanaka Shuji   Wiemer Maik   Otto Thomas  

Micromachines, Vol. 7, Iss. 12, 2016-12 ,pp. : 234-234

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Self-Assembly of Microscale Parts through Magnetic and Capillary Interactions

By Morris Christopher J.   Isaacson Brian   Grapes Michael D.   Dubey Madan  

Micromachines, Vol. 2, Iss. 1, 2011-03 ,pp. : 69-81

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Fabrication and Characterization of Capacitive Micromachined Ultrasonic Transducers with Low-Temperature Wafer Direct Bonding

By Wang Xiaoqing   Yu Yude   Ning Jin  

Micromachines, Vol. 7, Iss. 12, 2016-12 ,pp. : 226-226

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Oxide-Free Bonding of III-V-Based Material on Silicon and Nano-Structuration of the Hybrid Waveguide for Advanced Optical Functions

By Pantzas Konstantinos   Itawi Ahmad   Sagnes Isabelle   Patriarche Gilles   Le Bourhis Eric   Lupu Anatole   Benisty Henri   Talneau Anne  

Photonics, Vol. 2, Iss. 4, 2015-10 ,pp. : 1054-1064

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