Formation Mechanism of Porous Cu3Sn Intermetallic Compounds by High Current Stressing at High Temperatures in Low-Bump-Height Solder Joints

Author： Lin Jie-An   Lin Chung-Kuang   Liu Chen-Min   Huang Yi-Sa   Chen Chih   Chu David T.   Tu King-Ning  

Publisher： MDPI

E-ISSN： 2073-4352|6|1|12-12

ISSN： 2073-4352

Source： Crystals, Vol.6, Iss.1, 2016-01, pp. : 12-12

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