Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

Author： Jamadon Nashrah Hani   Tan Ai Wen   Yusof Farazila   Ariga Tadashi   Miyashita Yukio   Hamdi Mohd  

Publisher： MDPI

E-ISSN： 2075-4701|6|9|220-220

ISSN： 2075-4701

Source： Metals, Vol.6, Iss.9, 2016-09, pp. : 220-220

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