Effect of Cooling Rate on the Microstructural and Mechanical Properties of Sn-0.3Ag-0.7Cu-0.05Ni Solder Alloy

By  

Key Engineering Materials, Vol. 2017, Iss. 751, 2017-09 ,pp. : 9-13

Trans Tech Publications

Access to resources Recommend Favorite

Effect of TiO₂ on the Formation of Primary and Interfacial Cu₆Sn₅ in Sn-0.7wt%Cu and Sn-0.7wt%Cu-0.05wt%Ni Solder Paste during Soldering

By  

Key Engineering Materials, Vol. 2016, Iss. 700, 2016-08 ,pp. : 161-169

Trans Tech Publications

Access to resources Recommend Favorite

Solidification Condition Effects on Microstructures and Creep Resistance of Sn-3.8Ag-0.7Cu Lead-Free Solder

By Liang J.   Dariavach N.   Shangguan D.  

Metallurgical and Materials Transactions A, Vol. 38, Iss. 7, 2007-07 ,pp. : 1530-1538

Springer Publishing Company

Access to resources Recommend Favorite

Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2.5Ag0.8Cu0.5Sb solders in composite solder joints of LTCC/PWB assemblies

By Nousiainen O.   Kangasvieri T.   Rautioaho R.   Vähäkangas J.  

Soldering & Surface Mount Technology, Vol. 23, Iss. 1, 2011-02 ,pp. : 30-39

Emerald Group Publishing Ltd

Access to resources Recommend Favorite

A high-performance lead-free solder - the effects of In on 99.3Sn/0.7Cu

By Hwang Jennie S   Guo Zhenfeng   Koenigsmann Holger  

Soldering & Surface Mount Technology, Vol. 13, Iss. 2, 2001-04 ,pp. : 7-13

Emerald Group Publishing Ltd

Access to resources Recommend Favorite