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Metallurgical and Materials Transactions A, Vol. 38, Iss. 5, 2007-05 ,pp. : 1048-1055

Springer Publishing Company

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Effect of crystallographic anisotropy of β-tin grains on thermal fatigue properties of Sn–1Ag–0˙5Cu and Sn–3Ag–0˙5Cu lead free solder interconnects

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Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders

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