Themo-mechanical Interfacial Stress Analysis in Electronic Packaging at Different Temperature Conditions: Revisit Author’s Work

Author： Sujan D.  

Publisher： Edp Sciences

E-ISSN： 2261-236x|202|issue|01006-01006

ISSN： 2261-236x

Source： MATEC Web of conference, Vol.202, Iss.issue, 2018-09, pp. : 01006-01006

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