Material Selection for Interfacial Bond Layer in Electronic Packaging

Author: Sujan D.  

Publisher: Edp Sciences

E-ISSN: 2261-236x|202|issue|01005-01005

ISSN: 2261-236x

Source: MATEC Web of conference, Vol.202, Iss.issue, 2018-09, pp. : 01005-01005

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Abstract