Scaling the 3D Bumps Pitch from 20 to 10 μm, Focusing on the Wet Cu Seed Etch Process Development

Publisher： Trans Tech Publications

E-ISSN： 1662-9779|2014|219|237-240

ISSN： 1012-0394

Source： Solid State Phenomena, Vol.2014, Iss.219, 2014-01, pp. : 237-240

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