Wetting Behavior of Plasma Etch Residue Removal Solutions on Plasma Damaged and Repaired Porous ULK Dielectrics

Publisher: Trans Tech Publications

E-ISSN: 1662-9779|2014|219|193-196

ISSN: 1012-0394

Source: Solid State Phenomena, Vol.2014, Iss.219, 2014-01, pp. : 193-196

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Abstract