Effects of Soldering Temperature on IMCs Formation between Sn-0.7Cu Solder and Cu Substrate

Publisher： Trans Tech Publications

E-ISSN： 1662-7482|2015|713|2685-2688

ISSN： 1660-9336

Source： Applied Mechanics and Materials, Vol.2015, Iss.713, 2015-02, pp. : 2685-2688

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