Effect of Aluminium Addition on Microstructure and Microhardness of Sn-0.7Cu-xAl Lead-Free Solder Alloy

Publisher： Trans Tech Publications

E-ISSN： 1662-7482|2015|754|166-170

ISSN： 1660-9336

Source： Applied Mechanics and Materials, Vol.2015, Iss.754, 2015-05, pp. : 166-170

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Physical and Mechanical Behaviors of SnCu-Based Lead-Free Solder Alloys with an Addition of Aluminium

By  

Applied Mechanics and Materials, Vol. 2015, Iss. 815, 2015-12 ,pp. : 64-68

Trans Tech Publications

Access to resources Recommend Favorite

Influence of Silicon Nitride (Si3N4) Addition on Microstructure, Mechanical and Thermal Properties of Sn-0.7Cu Lead-Free Solder

By  

Applied Mechanics and Materials, Vol. 2015, Iss. 754, 2015-05 ,pp. : 530-534

Trans Tech Publications

Access to resources Recommend Favorite

Mechanical Properties and Solderability of Robust Sn-0.7Cu Lead-Free Composite Solder

By  

Applied Mechanics and Materials, Vol. 2015, Iss. 754, 2015-05 ,pp. : 556-560

Trans Tech Publications

Access to resources Recommend Favorite

Microstructure and Mechanical Properties of Sn-1.0Ag-0.7Cu (SAC107) Lead-Free Solder Reinforced Silicon Nitride (Si3N4) Particles

By  

Applied Mechanics and Materials, Vol. 2015, Iss. 754, 2015-05 ,pp. : 535-539

Trans Tech Publications

Access to resources Recommend Favorite

Creep Characteristic of Sn1.0Ag0.7Cu Lead-Free Solders with Element Addition

By  

Applied Mechanics and Materials, Vol. 2016, Iss. 853, 2017-01 ,pp. : 192-196

Trans Tech Publications

Access to resources Recommend Favorite