Influence of Silicon Nitride (Si₃N₄) Addition on Microstructure, Mechanical and Thermal Properties of Sn-0.7Cu Lead-Free Solder

Publisher： Trans Tech Publications

E-ISSN： 1662-7482|2015|754|530-534

ISSN： 1660-9336

Source： Applied Mechanics and Materials, Vol.2015, Iss.754, 2015-05, pp. : 530-534

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