Microstructure and Mechanical Properties of Sn-1.0Ag-0.7Cu (SAC107) Lead-Free Solder Reinforced Silicon Nitride (Si₃N₄) Particles

Publisher： Trans Tech Publications

E-ISSN： 1662-7482|2015|754|535-539

ISSN： 1660-9336

Source： Applied Mechanics and Materials, Vol.2015, Iss.754, 2015-05, pp. : 535-539

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