Comparison of 2.5D and 3D Simulation Methods for Limiting Electrode Debiasing of 4H-SiC Interdigitated Devices

Publisher: Trans Tech Publications

E-ISSN: 1662-9752|2016|858|757-760

ISSN: 0255-5476

Source: Materials Science Forum, Vol.2016, Iss.858, 2016-06, pp. : 757-760

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Abstract