Publisher: Trans Tech Publications
E-ISSN: 1662-9752|2016|858|549-552
ISSN: 0255-5476
Source: Materials Science Forum, Vol.2016, Iss.858, 2016-06, pp. : 549-552
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Low Resistance Ti-Si-C Ohmic Contacts for 4H-SiC Power Devices Using Laser Annealing
Materials Science Forum, Vol. 2017, Iss. 897, 2017-06 ,pp. :
4H-SiC nMOSFETs with As-Doped S/D and NbNi Silicide Ohmic Contacts
Materials Science Forum, Vol. 2016, Iss. 858, 2016-06 ,pp. :
Characterization of Comet-Shaped Defects on C-Face 4H-SiC Epitaxial Wafers
Materials Science Forum, Vol. 2015, Iss. 821, 2015-07 ,pp. :