The Alloying and Aging Effects on the Wettability and Intermetallic Bonding of the Sn-Zn-Cu-Bi Soldering Alloy on a Cu Substrate

Publisher： Trans Tech Publications

E-ISSN： 1662-9752|2016|857|26-30

ISSN： 0255-5476

Source： Materials Science Forum, Vol.2016, Iss.857, 2016-06, pp. : 26-30

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract

Related content

Nickel Nanoparticles Mediated Growth of the Intermetallic Compound between Sn-1.0Ag-Xni Solders Alloy and Cu Substrate

By  

Materials Science Forum, Vol. 2015, Iss. 815, 2015-05 ,pp. : 103-108

Trans Tech Publications

Access to resources Recommend Favorite

Effects of Cobalt Nanoparticles Addition on Shear Strength, Wettability and Interfacial Intermetallic Growth of Sn−3.0Ag−0.5Cu Solder during Thermal Cycling

By  

Materials Science Forum, Vol. 2015, Iss. 815, 2015-05 ,pp. : 97-102

Trans Tech Publications

Access to resources Recommend Favorite

Effect of Ag Addition on Growth of the Interfacial Intermetallic Compounds between Sn-0.7Cu Solder and Cu Substrate

By  

Materials Science Forum, Vol. 2015, Iss. 815, 2015-05 ,pp. : 129-134

Trans Tech Publications

Access to resources Recommend Favorite

Wettability and Bond Shear Strength of Sn-9Zn Lead-Free Solder Alloy Reflowed on Copper Substrate

By  

Materials Science Forum, Vol. 2015, Iss. 830, 2015-10 ,pp. : 215-218

Trans Tech Publications

Access to resources Recommend Favorite

Production of Cu-Sn-Zn Ternary Alloy Coating via Electroplating

By  

Materials Science Forum, Vol. 2017, Iss. 888, 2017-04 ,pp. : 400-403

Trans Tech Publications

Access to resources Recommend Favorite