Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging

Publisher: Edp Sciences

E-ISSN: 2261-236x|95|issue|01003-01003

ISSN: 2261-236x

Source: MATEC Web of conference, Vol.95, Iss.issue, 2017-02, pp. : 01003-01003

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Abstract