

Author: Ghoshal Sushanta
Publisher: Springer Publishing Company
ISSN: 1566-2543
Source: Journal of Polymers and the Environment, Vol.18, Iss.3, 2010-09, pp. : 216-223
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content




Effect of Bond Layer Properties to Thermo-Mechanical Stresses in Flip Chip Packaging
MATEC Web of conference, Vol. 95, Iss. issue, 2017-02 ,pp. :


By Suyatma Nugraha E. Copinet Alain Tighzert Lan Coma Veronique
Journal of Polymers and the Environment, Vol. 12, Iss. 1, 2004-01 ,pp. :

