O‐Fmoc‐protected 3‐hydroxy‐2‐butenoate derivatives as thermal latent curing agents for thermosetting epoxy resins

Publisher: John Wiley & Sons Inc

E-ISSN: 1099-0518|56|5|471-474

ISSN: 0887-624x

Source: Journal of Polymer Science Part A: Polymer Chemistry, Vol.56, Iss.5, 2018-03, pp. : 471-474

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Abstract

To improve the stability of epoxy resin‐imidazole compositions, the authors have developed O‐Fmoc‐protected 3‐hydroxy‐2‐butenoate derivatives to generate an imidazole via thermal deprotection and subsequent β‐elimination reactions. The latent curing agents have good compatibility toward epoxy resins. It was found that high reactivity of the agents with epoxy resins is accomplished after their thermal decomposition reaction and that the composition shows long‐term storage stability at room temperature.