Related content

The morphology and kinetic evolution of intermetallic compounds at Sn-Ag-Cu solder/Cu and Sn-Ag-Cu-0.5Al 2 O 3 composite solder/Cu interface during soldering reaction

By Chang S.  

Journal of Materials Science: Materials in Electronics, Vol. 23, Iss. 1, 2012-01 ,pp. : 100-107

Springer Publishing Company

Access to resources Recommend Favorite

Cu²⁺ ions in sodium fluoride-sodium borate glasses studied by EPR and optical absorption techniques

By Prakash P. G.   Rao J. L.  

Journal of Materials Science, Vol. 39, Iss. 1, 2004-01 ,pp. : 193-200

Springer Publishing Company

Access to resources Recommend Favorite

Incipient melting of Al5Mg8Si6Cu2 and Al2Cu intermetallics in unmodified and strontium-modified Al–Si–Cu–Mg (319) alloys during solution heat treatment

By Samuel F.H  

Journal of Materials Science, Vol. 33, Iss. 9, 1998-05 ,pp. : 2283-2297

Springer Publishing Company

Access to resources Recommend Favorite

Preparation of Cu2O-Cu Cermets by In Situ Reduction Method

By Feng Lichao   Yu Xuemei   Zhang Yuanliang  

International Journal of Applied Ceramic Technology, Vol. 12, Iss. 1, 2015-05 ,pp. : E105-E111

Blackwell Publishing

Access to resources Recommend Favorite

Synthesis and characterization of Cu2O·TeO2 and CuI·Cu2O·TeO2 glasses

By Chowdari B.V.R.   Tan K.L.   Ling F.  

Journal of Materials Science, Vol. 35, Iss. 8, 2000-04 ,pp. : 2015-2027

Springer Publishing Company

Access to resources Recommend Favorite