散热强化型覆晶球栅数组组合体之锡球可靠度研究An Investigation of the Solder Ball Reliability for a Thermally Enhanced FC-PBGA Assembly

By 林家帆   吴俊煌   朱圣浩  

Applied Physics, Vol. 4, Iss. 7, 2014-07 ,pp. : 141-154

汉斯出版社

Access to resources Recommend Favorite

Finite-element analysis of a PBGA assembly under isothermal/mechanical twisting loading

By Yang Q.J.   Shi X.Q.   Wang Z.P.   Shi Z.F.  

Finite Elements in Analysis and Design, Vol. 39, Iss. 9, 2003-06 ,pp. : 819-833

Elsevier

Access to resources Recommend Favorite

Process capability study and thermal fatigue life prediction of ceramic BGA solder joints - Theory and Applications

By Xie D.J.   Wang Z.P.  

Finite Elements in Analysis and Design, Vol. 30, Iss. 1, 1998-07 ,pp. : 31-45

Elsevier

Access to resources Recommend Favorite

Fatigue crack propagation life analysis of solder joints under thermal cyclic loading

By Pidaparti R.M.V.   X. S.  

Theoretical and Applied Fracture Mechanics, Vol. 24, Iss. 2, 1996-01 ,pp. : 157-164

Elsevier

Access to resources Recommend Favorite

Thermally Triggered Frame‐Guided Assembly

By  

ANGEWANDTE CHEMIE INTERNATIONAL EDITION, Vol. 53, Iss. 49, 2014-12 ,pp. : 13468-13470

John Wiley & Sons Inc

Access to resources Recommend Favorite