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散热强化型覆晶球栅数组封装组合体内的凸块之疲劳寿命研究 Investigation of Fatigue Life of Solder Bumps in a Thermally Enhanced FC-PBGA Assembly
Publisher: 汉斯出版社
ISSN: 2160-7575
Source: Applied Physics, Vol.02, Iss.01, 2012-01, pp. : 20-27
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