Flip-chip packaging solution for CMOS image sensor device

Author: Kim J.-h.   Kang I.-S.   Song C.-j.   Hur Y.-J.   Kim H.-N.   Baek E.   Seo T.-J.  

Publisher: Elsevier

ISSN: 0026-2714

Source: Microelectronics Reliability, Vol.44, Iss.1, 2004-01, pp. : 155-161

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