Resistance behaviour and interdiffusion of layered CuNi-NiCr films

Author: Bruckner W.   Schumann S.   Baunack S.   Pitschke W.   Knuth T.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.258, Iss.1, 1995-03, pp. : 236-246

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract