High-reliability interconnection formation by a two-step switching bias sputtering process

Author: Onuki J.   Nihei M.   Koizumi M.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.266, Iss.2, 1995-10, pp. : 182-188

Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.

Previous Menu Next

Abstract