Thermal dry-etching of copper using hydrogen peroxide and hexafluoroacetylacetone

Author： Jain A.   Kodas T.T.   Hampden-Smith M.J.  

Publisher： Elsevier

ISSN： 0040-6090

Source： Thin Solid Films, Vol.269, Iss.1, 1995-11, pp. : 51-56

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