Dry patterning of copper films using an O 2 plasma and hexafluoroacetylacetone

Author: Lee W.   Yang H.-J.   Reucroft P.J.   Soh H.-S.   Kim J.-H.   Woo S.-L.   Lee J.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.392, Iss.1, 2001-07, pp. : 122-127

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Abstract