Author: Modhan S. Senthil Nathan S. Muralidhar G.K. Modhan Rao G.
Publisher: Elsevier
ISSN: 0040-6090
Source: Thin Solid Films, Vol.292, Iss.1, 1997-01, pp. : 20-25
Disclaimer: Any content in publications that violate the sovereignty, the constitution or regulations of the PRC is not accepted or approved by CNPIEC.
Abstract
Related content
Glow discharge and sputtering characteristics of copper alloys
By Habib S.K. Mousa I.A. Rizk A.
Vacuum, Vol. 47, Iss. 9, 1996-09 ,pp. :
Ti and Fe cathode sputtering by the glow discharge plasma
By Wronski Z. Sielanko J. Herec J.
Vacuum, Vol. 70, Iss. 2, 2003-03 ,pp. :
An Effect of Process Parameters to Anodic Thickness in Hard Anodizing Process
Materials Science Forum, Vol. 2016, Iss. 872, 2016-10 ,pp. :