The effect of copper implantation on the mechanical, structural properties and residual stress of polycrystalline alumina

Author: Halitim F.   Ikhlef N.   Boudoukha L.   Fantozzi G.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.300, Iss.1, 1997-05, pp. : 197-201

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Abstract