Characteristics of chemical-vapor-deposited copper on the Cu-seeded TiN substrates

Author: Kim S.   Choi D.-J.   Yoon K.-R.   Kim K.-H.   Koh S.-K.  

Publisher: Elsevier

ISSN: 0040-6090

Source: Thin Solid Films, Vol.311, Iss.1, 1997-12, pp. : 218-224

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Abstract